The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Apr. 25, 2014
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, JP;
Inventors:
Daisuke Kimijima, Matsumoto, JP;
Yuji Ichimura, Matsumoto, JP;
Assignee:
Fuji Electric Co., Ltd., Kawasaki-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/22 (2006.01); H01L 23/28 (2006.01); H01L 23/42 (2006.01); H01L 23/24 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/42 (2013.01); H01L 23/24 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/13091 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/3737 (2013.01); H01L 23/49811 (2013.01);
Abstract
Provided is a power module. The power module includes a power semiconductor chip. The power module further includes a case that accommodates the power semiconductor chip. A silicone gel seals the power semiconductor chip within the case. The silicone gel including a heat-resistant silicone gel containing 20 to 100 mass ppm of a metal complex comprising a metal selected from a group consisting of iron and platinum.