The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Dec. 22, 2010
Applicant:

Takeshi Kawabata, Osaka, JP;

Inventor:

Takeshi Kawabata, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/10 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 24/17 (2013.01); H01L 25/0657 (2013.01); H01L 2224/13099 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/014 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01);
Abstract

A semiconductor module having a second semiconductor packagemounted on a first semiconductor package, wherein the first semiconductor packageincludes: padsformed on the top surface of the first semiconductor package; external connection terminalsformed on the underside of the first semiconductor package, and viaselectrically connecting the padsand the connection terminals. In a radiographic plane viewed in a vertical direction relative to one surface of a second substrateof the second semiconductor package, the viaoverlaps one of the padand the connection terminal, the padand the connection terminaloverlap each other, and the padhas the center position outside the connection terminal


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