The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Jun. 11, 2013
Jochen Reinmuth, Reutlingen, DE;
Heribert Weber, Nuertingen, DE;
Timo Schary, Bremen, DE;
Yvonne Bergmann, Reutlingen, DE;
Jochen Reinmuth, Reutlingen, DE;
Heribert Weber, Nuertingen, DE;
Timo Schary, Bremen, DE;
Yvonne Bergmann, Reutlingen, DE;
ROBERT BOSCH GMBH, Stuttgart, DE;
Abstract
A method for producing a component having a semiconductor substrate with through-hole plating is provided, the through-plating being surrounded by a recess, and the semiconductor substrate having a first layer on one side, which covers the recess on the first side. The semiconductor substrate has a second layer on a second side, which covers the recess on the second side, and the through-hole plating is surrounded by a ring structure which is produced from the semiconductor substrate. The recess surrounding the ring structure is produced in the same process step or at the same time as the recess for the through-hole plating.