The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Dec. 11, 2012
Applicant:
Oclaro Japan, Inc., Kanagawa, JP;
Inventors:
Hiroshi Hamada, Kanagawa, JP;
Takashi Toyonaka, Kanagawa, JP;
Assignee:
Oclaro Japan, Inc., Kanagawa, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2014.01); H01L 31/0224 (2006.01); H01L 31/02 (2006.01); H01L 23/00 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0224 (2013.01); H01L 31/0232 (2013.01); H01L 31/02005 (2013.01); H01L 31/022408 (2013.01); G02B 6/4204 (2013.01); G02B 6/421 (2013.01); G02B 6/4238 (2013.01); G02B 6/4274 (2013.01); G02B 6/4292 (2013.01); H01L 24/13 (2013.01); H01L 24/29 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 2224/10145 (2013.01); H01L 2224/10175 (2013.01); H01L 2224/1308 (2013.01); H01L 2224/8338 (2013.01); H01L 2224/8138 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/26145 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/2908 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83444 (2013.01); H01L 2924/3841 (2013.01); H01L 2224/16225 (2013.01);
Abstract
Provided is a receiver module, including: a semiconductor light receiving element including an electrode; and a sub-mount including: an electrical wiring joined to the electrode with solder; and a trap region arranged around a joining surface of the electrical wiring, the trap region retaining solder by solder wetting.