The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Jun. 28, 2013
Applicant:

Koninklijke Philips N.v, Eindhoven, NL;

Inventor:

Serge J. Bierhuizen, Santa Rosa, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/52 (2010.01); H01L 31/12 (2006.01); H01L 25/075 (2006.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/52 (2013.01); H01L 25/0753 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 2924/09701 (2013.01); H01L 31/12 (2013.01); H01L 2224/48091 (2013.01);
Abstract

A multi-chip light emitting device (LED) uses a low-cost carrier structure that facilitates the use of substrates that are optimized to support the devices that require a substrate. Depending upon the type of LED elements used, some of the LED elements may be mounted on the carrier structure, rather than on the more expensive ceramic substrate. In like manner, other devices, such as sensors and control elements, may be mounted on the carrier structure as well. Because the carrier and substrate structures are formed independent of the encapsulation and other after-formation processes, these structures can be tested prior to encapsulation, thereby avoiding the cost of these processes being applied to inoperative structures.


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