The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Oct. 25, 2010
Applicants:
Yong Seon Song, Seoul, KR;
Jung Ha Hwang, Seoul, KR;
Inventors:
Yong Seon Song, Seoul, KR;
Jung Ha Hwang, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/508 (2013.01); H01L 33/505 (2013.01); H01L 33/54 (2013.01); H01L 2933/0041 (2013.01); H01L 2924/0002 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/45144 (2013.01);
Abstract
A light emitting device (LED) package includes a submount and a light emitting chip. The submount has a chip region and a supporting region over which the chip is mounted, and an encapsulating material and fluorescent material are formed over the chip. The coverage area of encapsulating and fluorescent materials is substantially coextensive with the chip or chip region, and a first area between an edge of the chip region and an edge of the supporting region is greater than a second area between the edge of the chip region and the chip.