The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Mar. 29, 2010
Applicant:

Ryuji Sugiura, Hamamatsu, JP;

Inventor:

Ryuji Sugiura, Hamamatsu, JP;

Assignee:

HAMAMATSU PHOTONICS K.K., Hamamatsu-shi, Shizuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/402 (2014.01); B23K 26/40 (2014.01);
U.S. Cl.
CPC ...
B23K 26/4075 (2013.01);
Abstract

A laser processing device () comprises a laser light source () for emitting a laser light (L) and a laser light source controller () for controlling the pulse width of the laser light (L) and irradiates an object to be processed () with the laser light (L) while locating a converging point (P) within the object (), so as to form a modified region along a line to cut () of the object () and generate a fracture extending in a thickness direction of the object () from the modified region as the modified region is formed. In the laser processing device (), the laser light source controller () changes the pulse width of the laser light (L) according to a data table in which the fracture length, the thickness of the object (), and the pulse width of the laser light (L) are associated with each other. That is, the pulse width is changed according to the fracture length generated from the modified region. Therefore, the laser processing device () can generate a fracture having a desirable length from the modified region.


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