The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Jan. 14, 2011
Kiyotaka Nakayama, Settsu, JP;
Toru Yoshida, Settsu, JP;
Kiyotaka Nakayama, Settsu, JP;
Toru Yoshida, Settsu, JP;
KANEKA CORPORATION, Osaka, JP;
Abstract
A polyethylene resin expanded particle has an expansion ratio of not less than 10 times and not more than 50 times, and in a DSC curve obtained by differential scanning calorimetry (DSC), the polyethylene resin expanded particle (i) shows two melting peaks, the two melting peaks being a low-temperature side melting peak and a high-temperature side melting peak, and (ii) further has a shoulder in a region not less than 100° C. and not more than the low-temperature side melting peak temperature, the shoulder having a shoulder ratio which is not less than 0.2% and not more than 3%. This makes it possible to obtain a polyethylene resin expanded particle for producing a polyethylene resin in-mold expansion molded article in which especially an end (edge part) of the polyethylene resin in-mold expansion molded article is excellent in fusion bond level and appearance and which has neither a wrinkle nor a void on a surface thereof, is excellent in surface property (has a beautiful surface), and has a high expansion ratio.