The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Jul. 03, 2012
Applicant:
Takahiko Yoshizawa, Sakata, JP;
Inventor:
Takahiko Yoshizawa, Sakata, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 31/0232 (2014.01); H01L 21/306 (2006.01); G01J 3/427 (2006.01); B81C 1/00 (2006.01); G01J 3/51 (2006.01); G01J 3/02 (2006.01);
U.S. Cl.
CPC ...
G01J 3/427 (2013.01); B81C 1/00007 (2013.01); B81C 1/0015 (2013.01); B81C 1/00126 (2013.01); G01J 3/513 (2013.01); G01J 3/0291 (2013.01); G01J 3/0278 (2013.01);
Abstract
A method for manufacturing a sloped structure is disclosed. The method includes the steps of: (a) forming a sacrificial film above a substrate; (b) forming a first film above the sacrificial film; (c) forming a second film having a first portion connected to the substrate, a second portion connected to the first film, and a third portion positioned between the first portion and the second portion; (d) removing the sacrificial film; and (e) bending the third portion of the second film after the step (d), thereby sloping the first film with respect to the substrate.