The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Aug. 27, 2013
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Seok-Jun Won, Seoul, KR;

Hyung-Suk Jung, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 29/66 (2006.01); H01L 21/8234 (2006.01); H01L 29/51 (2006.01); H01L 21/28 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66545 (2013.01); H01L 21/823462 (2013.01); H01L 21/28088 (2013.01); H01L 21/28202 (2013.01); H01L 29/4966 (2013.01); H01L 29/517 (2013.01); H01L 29/518 (2013.01);
Abstract

A method of fabricating a semiconductor device includes providing a dummy gate insulation film formed on a substrate, the dummy gate insulation film including a first material and providing a spacer formed at least one side of the gate insulation film, the spacer including the first material, removing the first material included in the dummy gate insulation film by a first process, removing the dummy gate insulation film from which the first material has been removed by a second process different from the first process, and sequentially forming a gate insulation film and a gate electrode structure on the substrate.


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