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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9034475 B1

PDFFull Text
Date of Patent:
May. 19, 2015

Filed:

Feb. 19, 2013

Thermosetting adhesive composition, and heat resistant adhesive film and wiring film using the same

Applicants:

Hitachi Cable, Ltd., Chiyoda-ku, Tokyo, JP;

Hitachi Cable Fine-tech, Ltd., Hitachi-shi, Ibaraki, JP;

Inventors:

Satoru Amou, Hitachi, JP;

Tomiya Abe, Hitachi, JP;

Daisuke Shanai, Hitachi, JP;

Hiroaki Komatsu, Hitachi, JP;

Kenichi Murakami, Hitachi, JP;

Assignee:

Hitachi Metals, Ltd., Tokyo, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 27/18 (2006.01); B32B 27/20 (2006.01); B32B 27/26 (2006.01); B32B 27/28 (2006.01); C09J 163/00 (2006.01); C09J 171/10 (2006.01); C08K 7/04 (2006.01); C09J 171/00 (2006.01); C09J 181/06 (2006.01); B32B 5/00 (2006.01); H05K 1/02 (2006.01); H05K 3/38 (2006.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 3/08 (2006.01);
U.S. Cl.
CPC ...
C09J 171/00 (2013.01); C09J 181/06 (2013.01); B32B 5/00 (2013.01); H05K 1/02 (2013.01); C08G 2650/54 (2013.01); H05K 3/386 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0248 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 27/08 (2013.01); B32B 27/281 (2013.01); B32B 3/08 (2013.01); B32B 2307/306 (2013.01); B32B 2307/7246 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01);
Abstract

Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film.

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