The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Aug. 28, 2009
Haihua Zhou, Beijing, CN;
Yanlin Song, Beijing, CN;
Haihua Zhou, Beijing, CN;
Yanlin Song, Beijing, CN;
Institute of Chemistry, Chinese Academy of Sciences, Beijing, CN;
Abstract
A method for preparing a metal substrate for inkjet CTP, comprising: treating a metal substrate by anodizing or non-anodizing (such as sandpaper burnishing, sand blasting, polishing, or brushing), and then applying a hydrophilic polymer paint on the surface of the metal substrate. Due to the existence of nano-size or micron-size oxide particles in the hydrophilic polymer paint, the metal substrate has high specific surface energy, while the metal substrate has a certain roughness, therefore the metal substrate has ink absorbency and good abrasive resistance. The metal substrate can reduce the spread of ink droplets and produces print image having better resolution and definition. The non-anodizing method can avoid environmental pollution which is caused by waste acid and waste alkali discharge of anodizing method.