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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9034417 B1

PDFFull Text
Date of Patent:
May. 19, 2015

Filed:

Aug. 20, 2012

Photonic sintering of polymer thick film conductor compositions

Applicants:

Vince Arancio, Bristol, GB;

Jay Robert Dorfman, Durham, NC (US);

Inventors:

Vince Arancio, Bristol, GB;

Jay Robert Dorfman, Durham, NC (US);

Assignee:

E I DU PONT DE NEMOURS AND COMPANY, Wilmington, DE (US);

Attorney:
Primary Examiner:

Gordon R Baldwin

Assistant Examiner:

Mohammad Mayy

Int. Cl.
CPC ...
C23C 24/00 (2006.01); H01L 31/0224 (2006.01); B23K 35/26 (2006.01); B29C 67/04 (2006.01); C08K 3/08 (2006.01); C08L 27/08 (2006.01); C08L 35/04 (2006.01); C22C 13/00 (2006.01); H01B 1/22 (2006.01); B22F 7/08 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); H05K 1/09 (2006.01); H05K 3/10 (2006.01); H05K 3/12 (2006.01); C09D 11/52 (2014.01); C22C 12/00 (2006.01); C22C 1/04 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01L 31/022425 (2013.01); B23K 35/26 (2013.01); B29C 67/04 (2013.01); C08K 3/08 (2013.01); C08L 27/08 (2013.01); C08L 35/04 (2013.01); C22C 12/00 (2013.01); C22C 13/00 (2013.01); H01B 1/22 (2013.01); B22F 7/08 (2013.01); C22C 1/0483 (2013.01); B22F 2998/10 (2013.01); B23K 35/262 (2013.01); B23K 35/3006 (2013.01); B23K 35/3613 (2013.01); H05K 1/0346 (2013.01); H05K 1/095 (2013.01); H05K 3/106 (2013.01); H05K 3/1283 (2013.01); H05K 2201/0305 (2013.01); H05K 2203/0783 (2013.01); H05K 2203/1131 (2013.01); C09D 11/52 (2013.01); Y02E 10/50 (2013.01);
Abstract

This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to photonic sintering. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to photonic sintering. The invention further provides devices containing electrical conductors made by these methods.

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