The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Jul. 11, 2012
Applicants:
Andreas Koellnberger, Kirchdorf, DE;
Frank Achenbach, Simbach, DE;
Inventors:
Andreas Koellnberger, Kirchdorf, DE;
Frank Achenbach, Simbach, DE;
Assignee:
Wacker Chemie AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/76 (2006.01); C09J 5/00 (2006.01); C09J 183/04 (2006.01); H01L 21/683 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
B29C 65/76 (2013.01); C09J 5/00 (2013.01); C09J 183/04 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); C09J 2203/326 (2013.01); C09J 2205/302 (2013.01); C09J 2483/00 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/6834 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01);
Abstract
A temporary adhesive for reversibly bonding a silicon wafer to a silicon support contains a crosslinkable organopolysiloxanes composition and a fatty acid or salt thereof or fatty acid ester as a release regulator having a density different from the crosslinkable organopolysiloxanes composition of at least 0.1 g/cm, which upon parting of the wafer from the substrate, the adhesive remains substantially adhered to the substrate.