The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Nov. 26, 2008
In-situ, multi-stage debulk, compaction, and single stage curing of thick composite repair laminates
Applicants:
Denver R. Whitworth, North Richland Hills, TX (US);
Vance N. Cribb, Grapevine, TX (US);
Dumitru R. Jitariu, Flower Mound, TX (US);
Inventors:
Denver R. Whitworth, North Richland Hills, TX (US);
Vance N. Cribb, Grapevine, TX (US);
Dumitru R. Jitariu, Flower Mound, TX (US);
Assignee:
Textron Innovations Inc., Providence, RI (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B32B 37/00 (2006.01); B28B 1/26 (2006.01); B29C 45/00 (2006.01); B29C 47/00 (2006.01); B29C 43/02 (2006.01); B29C 49/00 (2006.01); B29C 51/00 (2006.01); B32B 15/00 (2006.01); B29C 39/14 (2006.01); B29C 43/10 (2006.01); B28B 21/36 (2006.01); A01J 21/00 (2006.01); A01J 25/12 (2006.01); A21C 3/00 (2006.01); B29B 11/06 (2006.01); A23P 1/00 (2006.01); B29C 73/10 (2006.01); B32B 43/00 (2006.01); B29C 37/00 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
B29C 73/10 (2013.01); B29C 37/0075 (2013.01); B32B 38/10 (2013.01); B32B 43/00 (2013.01); B32B 2605/00 (2013.01); B32B 2605/18 (2013.01);
Abstract
A method for fabricating a repair laminate for a composite part having an exposed surface includes applying a bonding material to the exposed surface and forming an uncured ply stack assembly on the bonding material. The uncured ply stack assembly is formed by forming and compacting a series of uncured ply stacks. The ply stack assembly and bonding material are then cured.