The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Nov. 11, 2009
Hironao Okayama, Kudamatsu, JP;
Akira Kaneko, Kudamatsu, JP;
Takeshi Kato, Osaka, JP;
Masaya Konishi, Osaka, JP;
Hironao Okayama, Kudamatsu, JP;
Akira Kaneko, Kudamatsu, JP;
Takeshi Kato, Osaka, JP;
Masaya Konishi, Osaka, JP;
TOYO KOHAN CO., LTD., Tokyo, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
Abstract
A metal laminated substrate for an oxide superconducting wire is manufactured such that a non-magnetic metal plate Thaving a thickness of not more than 0.2 mm and a metal foil Tmade of Cu alloy which is formed by cold rolling at a draft of not less than 90% and has a thickness of not more than 50 μm is laminated to each other by room-temperature surface active bonding, after lamination, crystal of the metal foil is oriented by heat treatment at a temperature of not less than 150° C. and not more than 1000° C. and, thereafter, an epitaxial growth film Tmade of Ni or an Ni alloy having a thickness of not more than 10 μm is laminated to the metal foil.