The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Jan. 16, 2013
Applicant:

Tyco Electronics Corporation, Berwyn, PA (US);

Inventors:

Keith Edwin Miller, Manheim, PA (US);

Chong Hun Yi, Mechanicsburg, PA (US);

Matthew Richard McAlonis, Elizabethtown, PA (US);

Kevin Thackston, York, PA (US);

Dustin Carson Belack, Hummelston, PA (US);

Albert Tsang, Harrisburg, PA (US);

Nicholas Paul Ruffini, York, PA (US);

Darryl J. McKenney, Londonderry, NH (US);

Erica L. Ouellette, Dedham, MA (US);

Assignees:

TYCO ELECTRONICS CORPORATION, Berwyn, PA (US);

MERCURY SYSTEMS, INC., Chelmsford, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/48 (2006.01); H01R 13/26 (2006.01); H01R 13/24 (2006.01); H01R 12/71 (2011.01);
U.S. Cl.
CPC ...
H01R 13/26 (2013.01); H01R 12/714 (2013.01); H01R 13/2492 (2013.01);
Abstract

An electrical contact is provided for mating with a mating contact. The electrical contact includes a base extending a length along a central longitudinal axis, and an arm extending a length outward from the base along the central longitudinal of the base. The arm includes a first mating bump and a second mating bump. The first and second mating bumps have respective first and second mating surfaces. The arm is configured to engage the mating contact at each of the first and second mating surfaces to establish an electrical connection with the mating contact. The first mating surface of the first mating bump is spaced apart along the length of the arm from the second mating surface of the second mating bump.


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