The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9033465 B1

PDF
Full Text
Expired
Date of Patent:
May. 19, 2015

Filed:

Feb. 14, 2014
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Yuko Komatsu, Suwa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/135 (2006.01); B41J 2/16 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1606 (2013.01); B41J 2/14233 (2013.01); B41J 2/161 (2013.01); B41J 2/1642 (2013.01); B41J 2/1623 (2013.01); B41J 2/1632 (2013.01);
Abstract

A flow path unit having a liquid flow path through which liquid flows includes a first flow path substrate that forms a flow path wall of the liquid flow path, a second flow path substrate that forms a flow path wall of the liquid flow path, and a coating film that is provided on an area from a coating portion for coating the flow path wall of the first flow path substrate to a fixing portion for fixing the first flow path substrate and the second flow path substrate. Provided are the flow path unit in which the liquid flow path is coated with the coating film without inhibiting fixing of the substrates, a liquid ejecting head, a liquid ejecting apparatus, and a flow path unit manufacturing method.


Find Patent Forward Citations

Komatsu, Yuko. (2015). Flow path unit, liquid ejecting head, liquid ejecting apparatus, and flow path unit manufacturing method (U.S. Patent No. 9033465). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9033465

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