The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Dec. 13, 2013
Applicants:

Tetsuya Hamada, Kyoto, JP;

Takashi Taguchi, Kyoto, JP;

Inventors:

Tetsuya Hamada, Kyoto, JP;

Takashi Taguchi, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); H01L 21/67 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
G03F 7/20 (2013.01); H01L 21/67178 (2013.01); H01L 21/67225 (2013.01); H01L 21/67303 (2013.01); H01L 21/67742 (2013.01); H01L 21/67748 (2013.01); Y10S 134/902 (2013.01);
Abstract

A method for processing a plurality of substrates after forming a photosensitive film on each substrate includes carrying each substrate into a placement buffer including a plurality of supporters by a first transport mechanism; taking out each substrate from the placement buffer to an interface by a second transport mechanism; carrying each substrate into the exposure device; carrying each substrate out of the exposure device into the placement buffer by the second transport mechanism; taking out each substrate from the placement buffer to the processing section by the first transport mechanism; performing development processing on each substrate; making each substrate stand by at the placement buffer based on timing at which the exposure device can accept each substrate; and making each substrate stand by at the placement buffer based on timing at which the developing device can accept each substrate.


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