The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Jul. 03, 2013
Applicant:

Nextinput, Inc., Atlanta, GA (US);

Inventors:

Ian Campbell, Smyma, GA (US);

Ryan Diestelhorst, Atlanta, GA (US);

Assignee:

NextInput, Inc., Atlanta, GA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 1/22 (2006.01); G01L 1/18 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); G01L 1/14 (2006.01); G01L 1/26 (2006.01); G01L 5/16 (2006.01);
U.S. Cl.
CPC ...
G01L 1/18 (2013.01); B81B 3/0018 (2013.01); B81C 1/00134 (2013.01); G01L 1/148 (2013.01); G01L 1/26 (2013.01); G01L 5/162 (2013.01);
Abstract

A microelectromechanical ('MEMS') load sensor device for measuring a force applied by a human user is described herein. In one aspect, the load sensor device has a contact surface in communication with a touch surface which communicates forces originating on the touch surface to a deformable membrane, on which load sensor elements are arranged, such that the load sensor device produces a signal proportional to forces imparted by a human user along the touch surface. In another aspect, the load sensor device has an overload protection ring to protect the load sensor device from excessive forces. In another aspect, the load sensor device has embedded logic circuitry to allow a microcontroller to individually address load sensor devices organized into an array. In another aspect, the load sensor device has electrical and mechanical connectors such as solder bumps designed to minimize cost of final component manufacturing.


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