The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

Nov. 04, 2009
Applicants:

Radhakrishnan L. Nagarajan, Cupertino, CA (US);

Fred A. Kish, Jr., Palo Alto, CA (US);

David F. Welch, Menlo Park, CA (US);

Drew D. Perkins, Saratoga, CA (US);

Masaki Kato, Sunnyvale, CA (US);

Inventors:

Radhakrishnan L. Nagarajan, Cupertino, CA (US);

Fred A. Kish, Jr., Palo Alto, CA (US);

David F. Welch, Menlo Park, CA (US);

Drew D. Perkins, Saratoga, CA (US);

Masaki Kato, Sunnyvale, CA (US);

Assignee:

Infinera Corporation, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04J 14/02 (2006.01); H04B 10/50 (2013.01); G02B 6/12 (2006.01); B82Y 20/00 (2011.01); H01S 5/024 (2006.01); H01S 5/223 (2006.01); H01S 5/40 (2006.01); G02B 6/28 (2006.01); G02B 6/293 (2006.01); H01S 5/00 (2006.01); H01S 5/022 (2006.01); H01S 5/026 (2006.01); H01S 5/0683 (2006.01); H01S 5/10 (2006.01); H01S 5/12 (2006.01); H01S 5/343 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12033 (2013.01); B82Y 20/00 (2013.01); G02B 6/12019 (2013.01); G02B 6/2813 (2013.01); G02B 6/293 (2013.01); G02B 6/29317 (2013.01); G02B 6/29338 (2013.01); G02B 6/29352 (2013.01); H01S 5/005 (2013.01); H01S 5/0085 (2013.01); H01S 5/02248 (2013.01); H01S 5/024 (2013.01); H01S 5/0261 (2013.01); H01S 5/0265 (2013.01); H01S 5/0268 (2013.01); H01S 5/0683 (2013.01); H01S 5/1032 (2013.01); H01S 5/12 (2013.01); H01S 5/1221 (2013.01); H01S 5/2231 (2013.01); H01S 5/34306 (2013.01); H01S 5/4031 (2013.01); H01S 5/4087 (2013.01); H04B 10/506 (2013.01);
Abstract

A coolerless photonic integrated circuit (PIC), such as a semiconductor electro-absorption modulator/laser (EML) or a coolerless optical transmitter photonic integrated circuit (TxPIC), may be operated over a wide temperature range at temperatures higher then room temperature without the need for ambient cooling or hermetic packaging. Since there is large scale integration of N optical transmission signal WDM channels on a TxPIC chip, a new DWDM system approach with novel sensing schemes and adaptive algorithms provides intelligent control of the PIC to optimize its performance and to allow optical transmitter and receiver modules in DWDM systems to operate uncooled. Moreover, the wavelength grid of the on-chip channel laser sources may thermally float within a WDM wavelength band where the individual emission wavelengths of the laser sources are not fixed to wavelength peaks along a standardized wavelength grid but rather may move about with changes in ambient temperature. However, control is maintained such that the channel spectral spacing between channels across multiple signal channels, whether such spacing is periodic or aperiodic, between adjacent laser sources in the thermally floating wavelength grid are maintained in a fixed relationship. Means are then provided at an optical receiver to discover and lock onto floating wavelength grid of transmitted WDM signals and thereafter demultiplex the transmitted WDM signals for OE conversion.


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