The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

Aug. 23, 2012
Applicants:

Shawn X. Arnold, San Jose, CA (US);

Scott P. Mullins, Morgan Hill, CA (US);

Jeffrey M. Thoma, Mountain View, CA (US);

Ramamurthy Chandhrasekhar, Cupertino, CA (US);

Inventors:

Shawn X. Arnold, San Jose, CA (US);

Scott P. Mullins, Morgan Hill, CA (US);

Jeffrey M. Thoma, Mountain View, CA (US);

Ramamurthy Chandhrasekhar, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01L 23/552 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 23/3107 (2013.01);
Abstract

A low profile, space efficient circuit shield is disclosed. The shield includes top and bottom metal layers disposed on the top of and below an integrated circuit. In one embodiment the shield can include edge plating arranged to encircle the edges of the integrated circuit and couple the top and bottom metal layers together. In another embodiment, the shield can include through vias arranged to encircle the edges of the integrated circuit and couple the top and bottom metal layers together. In yet another embodiment, passive components can be disposed adjacent to the integrated circuit within the shield.


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