The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

Sep. 11, 2013
Applicant:

Omnivision Technologies (Shanghai) Co., Ltd., Shanghai, CN;

Inventors:

Ye Tao, Shanghai, CN;

Wei Yuan, Shanghai, CN;

Bo Jiang, Shanghai, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H04N 3/14 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2253 (2013.01); H05K 1/111 (2013.01); H05K 3/301 (2013.01); H05K 3/3436 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10969 (2013.01); H04N 5/2252 (2013.01); H04N 5/2257 (2013.01);
Abstract

A housing for protecting a wafer-level camera module and fixing the wafer-level camera module to a printed circuit board (PCB) includes: four side plates, defining a quadrilateral frame; four supporting plates each fixed to a lower portion of an inner face of a corresponding one of the four side plates, each supporting plate having a top face supporting a portion of the camera module; and four bottom plates each fixed to a lower portion of an outer face of a corresponding one of the four side plates, each bottom plate having a bottom face fixed to the PCB. The housing is capable of addressing the issues of poor housing-PCB soldering, paint falling off and surface scratching and improving the efficiency in UV lamp-utilized UV adhesive curing.


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