The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Dec. 28, 2011
Applicants:
Jae Bum Ko, Icheon-si, KR;
Sang Jin Byeon, Icheon-si, KR;
Inventors:
Jae Bum Ko, Icheon-si, KR;
Sang Jin Byeon, Icheon-si, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); G06F 1/32 (2006.01); G01R 31/3185 (2006.01); G11C 5/14 (2006.01); G11C 29/02 (2006.01);
U.S. Cl.
CPC ...
G06F 1/32 (2013.01); G01R 31/318558 (2013.01); G11C 5/14 (2013.01); G11C 29/021 (2013.01);
Abstract
A semiconductor integrated circuit includes a plurality of dies, wherein each of the dies is configured to enable a power circuit provided therein according to a power control signal, in a state in which the die was determined to be a good die or a fail die.