The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

Nov. 20, 2012
Applicants:

David M. Chen, Brookline, MA (US);

Jan H. Kuypers, Cambridge, MA (US);

Pritiraj Mohanty, Los Angeles, CA (US);

Klaus Juergen Schoepf, Chandler, AZ (US);

Guiti Zolfagharkhani, Brighton, MA (US);

Jason Goodelle, Boston, MA (US);

Reimund Rebel, Maricopa, AZ (US);

Inventors:

David M. Chen, Brookline, MA (US);

Jan H. Kuypers, Cambridge, MA (US);

Pritiraj Mohanty, Los Angeles, CA (US);

Klaus Juergen Schoepf, Chandler, AZ (US);

Guiti Zolfagharkhani, Brighton, MA (US);

Jason Goodelle, Boston, MA (US);

Reimund Rebel, Maricopa, AZ (US);

Assignee:

Sand 9, Inc., Cambridge, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01); H03H 3/007 (2006.01); H03H 9/02 (2006.01); B81B 3/00 (2006.01); H02N 1/00 (2006.01); H03H 9/24 (2006.01);
U.S. Cl.
CPC ...
H01L 41/053 (2013.01); H03H 3/007 (2013.01); H03H 9/02007 (2013.01); H03H 9/02244 (2013.01); H03H 9/02535 (2013.01); H03H 2009/241 (2013.01); B81B 3/0018 (2013.01); H02N 1/006 (2013.01);
Abstract

Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.


Find Patent Forward Citations

Loading…