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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9030032 B1

PDFFull Text
Date of Patent:
May. 12, 2015

Filed:

May. 15, 2012

Semiconductor device with peeling prevention marks and shield film

Applicants:

Takashi Kitahara, Kanagawa, JP;

Hiroshi Koguma, Kanagawa, JP;

Inventors:

Takashi Kitahara, Kanagawa, JP;

Hiroshi Koguma, Kanagawa, JP;

Assignee:

Renesas Electronics Corporation, Kanagawa, JP;

Attorney:

Mattingly & Malur, P.C.

Primary Examiner:

Matthew E Warren

Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 23/552 (2013.01); H01L 2223/54406 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54486 (2013.01); H01L 23/3107 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 21/561 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/13091 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45164 (2013.01); H01L 2924/3011 (2013.01); H01L 24/45 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/1306 (2013.01);
Abstract

Provided is a technology capable of inhibiting a shield film formed over a surface of a sealing body from peeling from the surface of the sealing body, and inhibiting a part of the shield film from bulging from the surface of the sealing body. The present invention is characterized in that a peeling-prevention-mark formation region is provided so as to surround a product-identification-mark formation region, and a plurality of peeling prevention marks are formed in the peeling-prevention-mark formation region. That is, the present invention is characterized in that the region of the surface region of the sealing body which is different from the product-identification-mark formation region is defined as the peeling-prevention-mark formation region, and the peeling prevention marks are formed in the peeling-prevention-mark formation region.

Find Patent Forward Citations

Kitahara, Takashi. (2015). Semiconductor device with peeling prevention marks and shield film (U.S. Patent No. 9030032). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9030032

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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