The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

Mar. 15, 2013
Applicants:

Chao-yuan Huang, Hsinchu, TW;

Yueh-feng Ho, Hsinchu, TW;

Ming-sheng Yang, Hsinchu, TW;

Hwi-huang Chen, Hsinchu, TW;

Inventors:

Chao-Yuan Huang, Hsinchu, TW;

Yueh-Feng Ho, Hsinchu, TW;

Ming-Sheng Yang, Hsinchu, TW;

Hwi-Huang Chen, Hsinchu, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 2924/0002 (2013.01); H01L 2224/13 (2013.01);
Abstract

An integrated circuit layout comprises a through silicon via (TSV) configured to couple positive operational voltage VDD (VDD TSV), a through silicon via (TSV) configured to couple operational signals (signal TSV), a plurality of through silicon vias (TSVs) configured to couple operational voltage VSS (VSS TSVs) around the VDD TSV and the signal TSV and one or more backside redistribution lines (RDLs) connecting the VSS TSVs together to form a web-like heat dissipating structure at least surrounding the VDD TSV and the signal TSV.


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