The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Sep. 08, 2011
Applicant:
Jik-ho Song, Seoul, KR;
Inventor:
Jik-ho Song, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H05K 1/11 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/113 (2013.01); H01L 23/3128 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H05K 2201/0979 (2013.01); H05K 2201/10674 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/01327 (2013.01);
Abstract
Provided are a printed circuit board (PCB) having hexagonally aligned bump pads as a substrate of a semiconductor package, and a semiconductor package including the same. The PCB includes: a PCB body; a bottom metal layer at a bottom of the PCB body; and a top metal layer at a top of the PCB body, and the top metal layer includes: vias vertically connected to the PCB body; bump pads hexagonally aligned in a horizontal direction around the vias; and connection patterns connecting the vias to two or more of the bump pads. Accordingly, the number of bump pads in a unit area of the PCB may be increased.