The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Oct. 13, 2010
Applicant:
Daisuke Mizutani, Kawasaki, JP;
Inventor:
Daisuke Mizutani, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H05K 1/14 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01); H01L 21/768 (2006.01); H05K 1/02 (2006.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 1/147 (2013.01); H01L 21/76898 (2013.01); H05K 1/0218 (2013.01); H05K 1/141 (2013.01); H05K 3/222 (2013.01); H05K 3/3436 (2013.01); H05K 3/363 (2013.01); H05K 2201/0379 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/092 (2013.01); H05K 2201/10666 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/167 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A semiconductor device includes a first circuit base member including a surface having multiple first electrodes formed thereon, a second circuit base member being provided above the first circuit base member and having first through holes and second through holes formed respectively above the first electrodes, a semiconductor package provided above the second circuit base member, and multiple first bumps provided inside the first through holes and the second through holes to connect the first electrodes to the semiconductor package.