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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9029987 B1

PDFFull Text
Date of Patent:
May. 12, 2015

Filed:

Jun. 16, 2014

Laser machining method and chip

Applicant:

Hamamatsu Photonics K.k., Hamamatsu-shi, Shizuoka, JP;

Inventors:

Aiko Nakagawa, Hamamatsu, JP;

Takeshi Sakamoto, Hamamatsu, JP;

Assignee:

Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;

Attorney:

Drinker Biddle & Reath LLP

Primary Examiner:

Earl Taylor

Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/00 (2006.01); B23K 26/38 (2014.01); B23K 26/40 (2014.01); B23K 26/00 (2014.01); B23K 26/04 (2014.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); B23K 26/38 (2013.01); B23K 26/4075 (2013.01); H01L 21/67092 (2013.01); B23K 26/0057 (2013.01); B23K 26/046 (2013.01); B23K 2201/40 (2013.01); H01L 2924/0002 (2013.01);
Abstract

While reliably cutting an object to be processed, the strength of the resulting chips is improved. An object to be processedis irradiated with laser light L, so as to form modified regionsextending along lines to cutand aligning in the thickness direction in the object. Here, modified regionsare formed such that modified region formed partsand modified region unformed partsalternate along the lines, and modified regionsare formed such that modified region formed partsand modified region unformed partsalternate along the lines. This can inhibit formed modified regionsfrom lowering the strengths on the rear faceside and front faceside of chips obtained by cutting. On the other hand, modified regionslocated between the modified regionsare formed continuously from one end side of the linesto the other end side thereof, whereby the cuttability of the objectcan be secured reliably.

Find Patent Forward Citations

Nakagawa, Aiko. (2015). Laser machining method and chip (U.S. Patent No. 9029987). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9029987

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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