The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

Jan. 26, 2014
Applicant:

Lextar Electronics Corporation, Hsinchu, TW;

Inventor:

Kun-Fu Huang, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/24 (2010.01); H01L 33/06 (2010.01); H01L 33/32 (2010.01); H01L 33/60 (2010.01); H01L 33/04 (2010.01); H01L 33/38 (2010.01); H01L 33/14 (2010.01);
U.S. Cl.
CPC ...
H01L 33/24 (2013.01); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01L 33/60 (2013.01); H01L 33/04 (2013.01); H01L 33/387 (2013.01); H01L 33/14 (2013.01); H01L 33/382 (2013.01);
Abstract

A light emitting diode includes a substrate, a first semiconductor layer, a luminous layer, a second semiconductor layer, a current diffusion layer, a third semiconductor layer, a first electrode, a second electrode, and an insulation layer. The first semiconductor layer is formed above the substrate. The luminous layer is formed on the first semiconductor layer, and exposes a portion of the first semiconductor layer. The second semiconductor layer is formed on the luminous layer. The current diffusion layer is formed on the second semiconductor layer. The third semiconductor layer is formed on the current diffusion layer. The first electrode is formed on the first semiconductor layer. The second electrode includes a base portion formed on the surface of the substrate, and plural comb structures extending upward vertically. Each tip of the comb structure is in the third semiconductor layer. The insulation layer exposes the tip of each comb structure.


Find Patent Forward Citations

Loading…