The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Jun. 14, 2011
Applicants:
Munehiro Tada, Tokyo, JP;
Makoto Miyamura, Tokyo, JP;
Hiromitsu Hada, Tokyo, JP;
Inventors:
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 47/00 (2006.01); H01L 45/00 (2006.01); G11C 13/00 (2006.01); H01L 23/532 (2006.01); H01L 27/10 (2006.01); H01L 27/24 (2006.01);
U.S. Cl.
CPC ...
H01L 45/1253 (2013.01); G11C 13/0007 (2013.01); G11C 13/0014 (2013.01); G11C 13/003 (2013.01); G11C 13/0069 (2013.01); G11C 2013/0073 (2013.01); H01L 23/53238 (2013.01); H01L 27/101 (2013.01); H01L 27/2436 (2013.01); H01L 45/085 (2013.01); H01L 45/1233 (2013.01); H01L 45/146 (2013.01); H01L 45/16 (2013.01); H01L 45/1266 (2013.01); H01L 45/1675 (2013.01); H01L 27/2472 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device includes multilayer interconnects and two variable resistance elements () that are provided among the multilayer interconnects and that include first electrodes (), second electrodes (), and variable resistance element films () that are each interposed between first electrodes () and respective second electrodes (). Either the first electrodes () or the second electrodes () of the two variable resistance elements () are unified.