The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

May. 29, 2013
Applicants:

Applied Materials, Inc., Santa Clara, CA (US);

Lawrence Livermore National Security, Llc, Livermore, CA (US);

Inventors:

Joseph M. Ranish, San Jose, CA (US);

Aaron Muir Hunter, Santa Cruz, CA (US);

Thomas F. Soules, Livermore, CA (US);

Alexander M. Rubenchik, Livermore, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/268 (2006.01); H05B 3/00 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H05B 3/00 (2013.01); H01L 21/268 (2013.01); H01L 21/67115 (2013.01); H01L 21/67248 (2013.01); H01L 21/68792 (2013.01); Y10S 148/09 (2013.01); Y10S 148/093 (2013.01);
Abstract

Embodiments of the present invention provide apparatus and methods for performing rapid thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate. The apparatus includes a heating source disposed outside a chamber body and configured to provide thermal energy towards a processing volume. The substrate support defines a substrate supporting plane, and the substrate support is configured to support the substrate in the substrate supporting plane. The heating source includes a frame member having an inner wall surrounding an area large enough to encompass a surface area of the substrate, and a plurality of diode laser tiles mounted on the inner wall of the frame member. Each of the plurality of diode laser tiles is directed towards a corresponding area in the processing volume.


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