The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Dec. 06, 2012
Applicant:
Samsung Display Co., Ltd., Yongin, Gyeonggi-Do, KR;
Inventors:
Byung-Goo Jung, Goyang-si, KR;
Joo-Yeon Won, Seoul, KR;
Chong-Guk Lee, Seoul, KR;
Sung-Dong Park, Asan-si, KR;
Assignee:
Samsung Display Co., Ltd., , KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 7/06 (2006.01); H05K 1/03 (2006.01); H01L 23/495 (2006.01); G02F 1/1345 (2006.01);
U.S. Cl.
CPC ...
H05K 7/06 (2013.01); H05K 1/0393 (2013.01); H01L 23/49572 (2013.01); G02F 1/13452 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A tape package includes a base substrate, an input lead line disposed on the base substrate, the input lead line including a main input lead line and a sub input lead line, the sub input lead line branching off and extending from the main input lead line, an integrated circuit chip electrically connected to the sub input lead line, and a sealing part fixing the integrated circuit chip on the base substrate and overlapping a portion of the main input lead line.