The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Apr. 14, 2011
Applicants:
Tetsuya Oosawa, Ibaraki, JP;
Mitsuru Honjo, Ibaraki, JP;
Daisuke Yamauchi, Ibaraki, JP;
Inventors:
Assignee:
Nitto Denko Corporation, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/05 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/056 (2013.01); H05K 1/0245 (2013.01); H05K 1/0251 (2013.01);
Abstract
A base insulating layer is formed on a suspension body. Read wiring patterns, write wiring patterns and a ground pattern are formed in parallel on the base insulating layer. A first cover insulating layer is formed on the base insulating layer to cover the read wiring patterns, the write wiring patterns and the ground pattern. A ground layer is formed in a region on the first cover insulating layer above the write wiring patterns. A second cover insulating layer is formed on the first cover insulating layer to cover the ground layer.