The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Dec. 28, 2010
Kei Yamamoto, Tokyo, JP;
Takashi Nishimura, Tokyo, JP;
Kenji Mimura, Tokyo, JP;
Motoki Masaki, Tokyo, JP;
Seiki Hiramatsu, Tokyo, JP;
Xiaohong Yin, Tokyo, JP;
Kei Yamamoto, Tokyo, JP;
Takashi Nishimura, Tokyo, JP;
Kenji Mimura, Tokyo, JP;
Motoki Masaki, Tokyo, JP;
Seiki Hiramatsu, Tokyo, JP;
Xiaohong Yin, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 μm to 80 μm. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.