The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Jul. 13, 2007
Hiroyuki Yano, Kyoto, JP;
Masaya Nogi, Kyoto, JP;
Shinsuke Ifuku, Kyoto, JP;
Kentarou Abe, Kyoto, JP;
Keishin Handa, Kanagawa, JP;
Hiroyuki Yano, Kyoto, JP;
Masaya Nogi, Kyoto, JP;
Shinsuke Ifuku, Kyoto, JP;
Kentarou Abe, Kyoto, JP;
Keishin Handa, Kanagawa, JP;
Mitsubishi Chemical Corporation, Tokyo, JP;
Rohm Co., Ltd., Kyoto-shi, JP;
Abstract
Provided is a nanofiber sheet that sufficiently refined by fibrillation and has high crystallinity of cellulose fiber and can realize a fiber-reinforced composite material exhibiting high transparency, a high elastic modulus, a low coefficient of linear thermal expansion, and high heat resistance and being high in flatness and smoothness. This nanofiber sheet includes crystalline cellulose as the main component and a lignin in an amount of from 10 ppm to 10 wt %. When a fiber/resin composite material obtained by impregnating the nanofiber sheet with tricyclodecane dimethacrylate, subjecting the impregnated product to UV-curing at 20 J/cm, and heating the cured product in vacuum at 160° C. for two hours includes 60 wt % of the cured tricyclodecane dimethacrylate and 40 wt % of nanofiber, the following physical characteristics (i) to (iii) are satisfied: (i) the parallel light transmittance of light of a wavelength of 600 nm at a sheet thickness of 100 μm is 70% or more; (ii) the Young's modulus is 5.0 GPa or more; and (iii) the coefficient of linear thermal expansion is 20 ppm/K or less.