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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9029270 B1

PDFFull Text
Date of Patent:
May. 12, 2015

Filed:

Sep. 12, 2011

Phenolic resin composition, and methods for manufacturing cured relief pattern and semiconductor

Applicants:

Takahiro Sasaki, Toyko, JP;

Jun LI, Tokyo, JP;

Inventors:

Takahiro Sasaki, Toyko, JP;

Jun Li, Tokyo, JP;

Assignee:

Asahi Kasei E-Materials Corporation, Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Brook Kebede

Int. Cl.
CPC ...
H01L 21/461 (2006.01); G03F 7/004 (2006.01); C08L 61/34 (2006.01); C08G 61/02 (2006.01); H01L 21/30 (2006.01); H01L 29/06 (2006.01); C08K 5/42 (2006.01); G03F 7/023 (2006.01); G03F 7/038 (2006.01);
U.S. Cl.
CPC ...
G03F 7/004 (2013.01); C08L 61/34 (2013.01); C08G 61/02 (2013.01); C08G 2261/3424 (2013.01); H01L 21/30 (2013.01); H01L 29/06 (2013.01); C08K 5/42 (2013.01); G03F 7/0236 (2013.01); G03F 7/038 (2013.01);
Abstract

Provided is a photopolymer composition for a semiconductor element surface protective film or an interlayer insulating film, in which a solution of the photopolymer composition comprises 100 parts by mass of (A) a phenolic resin having a biphenyldiyl structure in a main chain of the resin; 1 to 30 parts by mass of (B) a photo acid-generating agent; and 1 to 60 parts by mass of (C) a compound that can be reacted with ingredient (A) by means of an acid generated from the photo acid-generating agent or heat.

Find Patent Forward Citations

Sasaki, Takahiro. (2015). Phenolic resin composition, and methods for manufacturing cured relief pattern and semiconductor (U.S. Patent No. 9029270). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9029270

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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