The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Feb. 24, 2012
Michael Bourbina, Midland, MI (US);
Jeffrey N. Bremmer, Midland, MI (US);
Eric S. Moyer, Midland, MI (US);
Sheng Wang, Midland, MI (US);
Craig R. Yeakle, Midland, MI (US);
Michael Bourbina, Midland, MI (US);
Jeffrey N. Bremmer, Midland, MI (US);
Eric S. Moyer, Midland, MI (US);
Sheng Wang, Midland, MI (US);
Craig R. Yeakle, Midland, MI (US);
Dow Corning Corporation, Midland, MI (US);
Abstract
A method of treating the surface of a semiconductor wafer through the formation of a bonding system is provided in order to enhance the handling of the wafer during subsequent processing operations. The method generally comprises the steps of applying a release layer and an adhesive to different wafers; bonding the wafers together to form a bonded wafer system; performing at least one wafer processing operation (e.g., wafer grinding, etc.) to form a thin processed wafer; debonding the wafers; and then cleaning the surface of the processed wafer with an organic solvent that is capable of dissolving the release layer or any residue thereof. The adhesive includes a vinyl-functionalized polysiloxane oligomeric resin, a Si—H functional polysiloxane oligomeric resin, a catalyst, and optionally an inhibitor, while the release layer is comprised of either a silsesquioxane-based resin or a thermoplastic resin.