The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Mar. 18, 2011
Yasuhiro Horimoto, Kusatsu, JP;
Yusuke Nakagawa, Kyoto, JP;
Tadashi Inoue, Yasu, JP;
Toshiyuki Takahashi, Otsu, JP;
Yasuhiro Horimoto, Kusatsu, JP;
Yusuke Nakagawa, Kyoto, JP;
Tadashi Inoue, Yasu, JP;
Toshiyuki Takahashi, Otsu, JP;
OMRON Corporation, Kyoto, JP;
Abstract
A method for manufacturing a semiconductor device is provided, the method comprising: fabricating a semiconductor element on a semiconductor substrate; joining a surface of the semiconductor substrate to a support member, the surface being on a side where the semiconductor element is fabricated; and polishing a surface on an opposite side of the surface of the semiconductor substrate where the semiconductor element is fabricated and reducing a thickness of the semiconductor substrate, in a state where the semiconductor substrate and the support member are joined.