The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Feb. 20, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Jens Schneider, Moritzburg, DE;
Henning Feick, Dresden, DE;
Marcel Heller, Stolpen, DE;
Dieter Kaiser, Dresden, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/266 (2006.01); G03F 1/00 (2012.01); G03F 7/20 (2006.01); H01L 29/36 (2006.01); G01L 1/22 (2006.01); H01L 21/027 (2006.01); H01L 21/265 (2006.01); H01L 43/06 (2006.01); H01L 43/14 (2006.01); H01L 29/78 (2006.01); H01L 29/08 (2006.01); H01L 27/02 (2006.01); H01L 29/861 (2006.01);
U.S. Cl.
CPC ...
H01L 21/266 (2013.01); G03F 1/00 (2013.01); G03F 7/70058 (2013.01); H01L 29/36 (2013.01); G01L 1/2293 (2013.01); H01L 21/0271 (2013.01); H01L 21/2652 (2013.01); H01L 21/26586 (2013.01); H01L 43/065 (2013.01); H01L 43/14 (2013.01); H01L 29/7835 (2013.01); H01L 29/0847 (2013.01); H01L 29/8611 (2013.01); H01L 27/0255 (2013.01);
Abstract
Various embodiments provide a method for processing a carrier, the method including changing the three-dimensional structure of a mask layer arranged over the carrier so that at least two mask layer regions are formed having different mask layer thicknesses; and applying an ion implantation process to the at least two mask layer regions to form at least two implanted regions in the carrier having different implantation depth profiles.