The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Mar. 15, 2013
Showa Denko Packaging Co., Ltd., Isehara-shi, Kanagawa, JP;
Showa Denko Packaging Co., Ltd., Kanagawa, JP;
Abstract
The molding packaging materialaccording to the present invention includes a heat resistant resin layeras an outer layer, a thermoplastic resin layeras an inner layer, a metal foil layerarranged between the heat resistant resin layer and the thermoplastic resin layer, and a black ink layerarranged between the metal foil layerand the heat resistant resin layer. The black ink layercontains carbon black, diamine, polyol, and hardening agent. The black ink layer does not partially crack and detach even when the molding packaging material according to the present invention is used in a somewhat harsh environment such as a hot and humid environment and/or at the time of molding or sealing.