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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9028638 B1

PDFFull Text
Date of Patent:
May. 12, 2015

Filed:

Jul. 01, 2011

Multilayer adhesive sheet and method for manufacturing electronic component

Applicants:

Takeshi Saito, Shibukawa, JP;

Kazunori Shikano, Shibukawa, JP;

Inventors:

Takeshi Saito, Shibukawa, JP;

Kazunori Shikano, Shibukawa, JP;

Assignee:

Denki Kagaku Kogyo Kabushiki Kaisha, Tokyo, JP;

Attorney:

Roberts Mlotkowski Safran & Cole P.C.

Primary Examiner:

Linda L Gray

Int. Cl.
CPC ...
C09J 175/04 (2006.01); C09J 143/04 (2006.01); C09J 11/06 (2006.01); H01L 21/02 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); C09J 7/02 (2006.01); C08G 18/67 (2006.01); C08G 18/79 (2006.01); C08G 18/80 (2006.01); C09D 4/06 (2006.01); C08F 220/18 (2006.01); C08F 265/04 (2006.01); C08F 290/14 (2006.01); C09J 151/00 (2006.01); C08F 222/10 (2006.01); C08L 75/14 (2006.01); C08G 77/442 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); Y10T 428/14 (2015.01); Y10T 156/1052 (2015.01); H01L 21/6836 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/274 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/838 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/10253 (2013.01); C08F 222/1006 (2013.01); C08L 75/14 (2013.01); H01L 2224/29 (2013.01); H01L 2224/2919 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/0665 (2013.01); C09J 7/02 (2013.01); C08G 18/673 (2013.01); C08G 18/792 (2013.01); C08G 18/8029 (2013.01); C09J 7/0246 (2013.01); C09J 7/0275 (2013.01); C09J 2203/326 (2013.01); C09J 2205/114 (2013.01); C09J 2423/006 (2013.01); C09J 2433/00 (2013.01); H01L 2224/29299 (2013.01); H01L 2224/2929 (2013.01); C08G 77/442 (2013.01); H01L 2924/00013 (2013.01); C09D 4/06 (2013.01); C08F 220/18 (2013.01); C08F 2222/104 (2013.01); C08F 2222/1086 (2013.01); C08F 265/04 (2013.01); C08F 290/147 (2013.01); C09J 151/003 (2013.01);
Abstract

Provided is a multilayer adhesive sheet which enables easy separation between an adhesive layer and a die attach film during the pick-up even in cases where an acrylate ester copolymer is used in the die attach film, thereby making the pick-up work of semiconductor chips after the dicing easy. The multilayer adhesive sheet comprises a base film, an adhesive layer that is disposed on one surface of the base film, and a die attach film that is disposed on an exposed surface of the adhesive layer. The adhesive that constitutes the adhesive layer contains: (A) a (meth)acrylate ester copolymer; (B) an ultraviolet polymerizable compound; (C) a multifunctional isocyanate curing agent; (D) a photopolymerization initiator; and (E) a silicone polymer.

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