The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

Apr. 10, 2012
Applicants:

Jin-kwang Kim, Yongin, KR;

Sang-joon Seo, Yongin, KR;

Seung-hun Kim, Yongin, KR;

Inventors:

Jin-Kwang Kim, Yongin, KR;

Sang-Joon Seo, Yongin, KR;

Seung-Hun Kim, Yongin, KR;

Assignee:

Samsung Display Co., Ltd., Giheung-Gu, Yongin, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/458 (2006.01); C23C 14/50 (2006.01); B01J 19/18 (2006.01); B01J 19/22 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
C23C 16/458 (2013.01); B01J 19/1887 (2013.01); B01J 19/22 (2013.01); C23C 14/50 (2013.01); C23C 16/45551 (2013.01);
Abstract

A rotating type thin film deposition apparatus having an improved structure that allows continuous deposition, and a thin film deposition method used by the rotating type thin film deposition apparatus are provided. The rotating type thin film deposition apparatus includes a deposition device; a circulation running unit that runs a deposition target on a circulation track via a deposition region of the deposition device; and a support unit that supports the deposition target and moves along the circulation track. Thin layers can be precisely and uniformly formed on the entire surface of a deposition target, and since deposition is performed while a plurality of deposition targets move along a caterpillar track, a working speed is faster compared to a method involving a general reciprocating motion, and the size of the thin film deposition apparatus can be reduced.


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