The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

Dec. 12, 2011
Applicants:

Kei Sato, Shizuoka, JP;

Shinji Kodama, Shizuoka, JP;

Inventors:

Kei Sato, Shizuoka, JP;

Shinji Kodama, Shizuoka, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/24 (2006.01); H01R 43/048 (2006.01); H01R 4/18 (2006.01); H01R 4/70 (2006.01); H01R 43/00 (2006.01);
U.S. Cl.
CPC ...
H01R 4/18 (2013.01); Y10T 29/49185 (2013.01); H01R 4/185 (2013.01); H01R 4/70 (2013.01); H01R 43/005 (2013.01); H01R 43/048 (2013.01);
Abstract

It is an objective to enhance sealing performance of a resin mold without subjecting a connector housing to special work. In an electric wire connection structure of a connector terminal in which an end of an electric wire (W) is connected to a rear portion of a connector terminal () and in which the electric wire connection is sealed of a resin mold (), a step (d) that makes an underside () of a rearmost end of the connector terminal () higher than an underside of an area ahead of the rearmost end is provided between the underside () of the rearmost end and the underside () ahead of the rearmost end, thereby assuring space () that enables filling of a resin which makes up a resin mold ().


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