The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
May. 15, 2012
Applicant:
Hsuan-hsien Lee, New Taipei, TW;
Inventor:
Hsuan-Hsien Lee, New Taipei, TW;
Assignee:
Edison Opto Corporation, New Taipei, TW;
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2006.01); F21K 99/00 (2010.01);
U.S. Cl.
CPC ...
F21K 9/135 (2013.01); F21K 9/00 (2013.01); F21V 29/70 (2015.01); F21V 29/89 (2015.01); F21V 29/22 (2013.01); F21V 29/15 (2015.01);
Abstract
A non-isolating circuit assembly includes a heat sink, a circular supporting member, a thermal insulation pad, and a light emitter. The heat sink has an inwardly-shrank platform. The circular supporting member is disposed around the outer edge of the inwardly-shrank platform. The thermal insulation pad is disposed on the inwardly-shrank platform and the circular supporting member. The area of the thermal insulation pad is larger than that of the inwardly-shrank platform, and the circular supporting member supports the outer edge of the thermal insulation pad. The light emitter is disposed on the thermal insulation pad.