The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

Sep. 19, 2013
Applicant:

Em-tech. Co., Ltd., Busan, KR;

Inventors:

Ji Hoon Kim, Gyeongsangnam-do, KR;

Joong Hak Kwon, Busan, KR;

Jung Hyung Lee, Gyeongsangnam-do, KR;

Hyeon Taek Oh, Gyeongsangnam-do, KR;

Assignee:

Em-Tech. Co., Ltd., Busan, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 7/02 (2006.01); H04R 7/14 (2006.01); H04R 9/04 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
H04R 7/02 (2013.01); H04R 7/14 (2013.01); H04R 9/043 (2013.01); H04R 31/003 (2013.01);
Abstract

The present invention relates to an assembly structure of a diaphragm for a microspeaker. The present invention discloses a bonding structure of a diaphragm for a microspeaker, the boding structure comprising: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression.


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