The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Jul. 05, 2007
Edgar Pawlowski, Stadecken-Elsheim, DE;
Ralf Biertuempfel, Mainz-Kastel, DE;
Bernd Woelfing, Mainz, DE;
Frank Fleissner, Mainz, DE;
Petra Auchter-krummel, Vendershein, DE;
Ulf Brauneck, Gross-Umstadt, DE;
Joseph S. Hayden, Clarks Summit, PA (US);
Ulrich Fotheringham, Wiesbaden, DE;
Edgar Pawlowski, Stadecken-Elsheim, DE;
Ralf Biertuempfel, Mainz-Kastel, DE;
Bernd Woelfing, Mainz, DE;
Frank Fleissner, Mainz, DE;
Petra Auchter-Krummel, Vendershein, DE;
Ulf Brauneck, Gross-Umstadt, DE;
Joseph S. Hayden, Clarks Summit, PA (US);
Ulrich Fotheringham, Wiesbaden, DE;
Schott AG, , DE;
Abstract
A method for producing optoelectronic components, the method comprising the steps of: providing optical components; picking up, by means of a robot arm, the optical components provided; subsequent to picking up the optical components, mounting the optical components directly on a first wafer by means of the robot arm; wherein the first wafer has optoelectronic components attached, and the optical components being positioned individually or in groups relative to the position of the optoelectronic components of the first wafer using the robot arm; and utilizing, as the first wafer, a glass wafer having i) spectrally filtering glass being an infrared filter glass and ii) an infrared filter coating, the glass wafer having a thickness in the range of 50 to 500 micrometers.