The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2015
Filed:
Nov. 20, 2011
Applicants:
Shahram Davari, Los Altos, CA (US);
Saied Tadayon, Potomac, MD (US);
Inventors:
Shahram Davari, Los Altos, CA (US);
Saied Tadayon, Potomac, MD (US);
Assignee:
Other;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04L 12/24 (2006.01); H04L 12/40 (2006.01); H04L 12/10 (2006.01); H04L 12/26 (2006.01);
U.S. Cl.
CPC ...
H04L 41/5038 (2013.01); H04L 43/00 (2013.01); H04L 12/2602 (2013.01); H04L 41/5003 (2013.01); H04L 43/10 (2013.01); H04L 43/0811 (2013.01); H04L 41/24 (2013.01); H04L 12/10 (2013.01); H04L 12/40032 (2013.01); H04L 43/0817 (2013.01); H04L 43/062 (2013.01); H04L 43/0841 (2013.01); H04L 43/0858 (2013.01); H04L 43/0835 (2013.01); H04L 43/0864 (2013.01); H04L 41/0213 (2013.01);
Abstract
In this application, we have the following examples: (1) Integrating the NID functionality in to the small foot-print of an SFP Module, with one or more of the features below: a) Mounting a NID SoC IC to an existing SFP Printed Circuit Board (PCB); b) Using the power from the SFP module, without requiring separate external power; c) NID SoC having only 2 ports, each with its own MAC and possibly PHY layer; d) NID SoC having an embedded microprocessor, RAM and ROM. Many examples and applications are provided.