The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Aug. 01, 2011
Applicant:

Takashi Muro, Makinohara, JP;

Inventor:

Takashi Muro, Makinohara, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 1/18 (2006.01); H01R 12/70 (2011.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01R 12/707 (2013.01); H05K 3/303 (2013.01); H05K 3/34 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/1031 (2013.01);
Abstract

A fixing fitting includes a solder connecting plate part soldered and fixed to a surface of the circuit board by using a cream solder and a parts fixing part which is fixed to a connector to be mounted on the circuit board. On a solder connected surface of a lower surface of the solder connecting plate part, V grooves are formed which suck up the cream solder applied on the surface of the circuit board in accordance with a capillary phenomenon. Further, a plurality of communicating holes which communicate with tapered parts of the V grooves and can suck up the cream solder by the capillary phenomenon are bored from an upper surface to the lower surface of the solder connecting plate part with prescribed spaces provided between them in the direction where the V grooves extend.


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